★ Edition 02 · forthcoming
The Packaging Frontier
Why Assembly, Test and Advanced Packaging May Matter More Than Fabs
Techadyant Labs · Strategic Intelligence
Semiconductor Ecosystems
The Packaging Frontier
Why Assembly, Test and Advanced Packaging May Matter More Than Fabs
Edition 02 · forthcoming
Forthcoming
Back-end assembly, test and advanced packaging is where a large share of near-term semiconductor employment and value addition will accrue in India. A structural look at the OSAT layer.
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New reports, signals and briefings on India’s industrial systems — infrequent and independent.