Advanced Packaging (2.5D/3D, Chiplets)
$0.40 bnAnnual import
3%Indian capability
5,400Supplier concentration (HHI)
₹8,000 crTo localise
Why India imports it. TSMC CoWoS, ASE, Amkor dominate; India's OSAT roadmap is 28nm wire bond, not chiplet.
Why it matters. AI accelerators use 2.5D packaging; localisation gap widens as AI accelerates.
Can India localise it? Hard - 7-10 year horizon for 2.5D/3D.
Where it comes from. Taiwan (70%), USA (20%), South Korea (10%).
Scorecard
The ten indices
CMDI 81Dependency
LPI 27Localisation potential
IAI 54Investment attractiveness
SRI 80.5Supply risk
SCI 63.25Supply-chain complexity
TRI 39Technology readiness
IMI 74Industrial multiplier
NSRI 68.45National-security relevance
EPI 56.25Export potential
ICGI 87.75Capability gap
Who makes it
Manufacturers
In India
No significant domestic maker.
Global leaders
TsmcAse GroupAmkor
On the ground
Localisation projects
- CG Power Sanand OSAT
Intelligence
Related signals
- India Now Has a Structured Map of Where It Stays Import-Dependent
- India's Deepest Chokepoints: EUV Photoresist, Leading-Edge Logic and Aero-Engines
- Where Dependency Meets Feasibility: SiC Power and Display-Driver ICs Are the Build-Now Surfaces
- High-Purity Minerals Enter the Semiconductor Feedstock Chain
Sources
Primary references
Confidence: Reasoned estimate. Reasoned estimate. Part of Techadyant Labs' Critical Manufacturing Dependencies (Edition I).