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Semiconductors

India's semiconductor programme is the single largest localisation bet of the decade, anchored by the India Semiconductor Mission and four fab + packaging approvals. Despite this, the country remains 100% import-dependent on logic and memory chips, with the first domestic 28nm node not expected before 2027. The dependency tier is Critical across the board.

75.13Dependency index
$21.9 bnStrategic imports
18Critical products
▲ 1.712-month trend
Critical products

Where the dependency sits

ProductCMDISourceImportVerdict
Advanced Logic Chips (sub-14nm)90.7Taiwan$3.2 bnPosition-early
DRAM & NAND Memory Chips88.5South Korea$4.5 bnPosition-early
Lithography Scanners (DUV & EUV)85.85Netherlands$0.60 bnWatch
300mm Silicon Wafers (Prime Grade)85.15Japan$1.2 bnBuild-now
Photoresists (KrF, ArF, EUV)85Japan$0.45 bnPosition-early
EDA Tools (Design Software)84.55USA$0.80 bnWatch
EUV Photoresist (Chemically Amplified)82.5Japan$0.12 bnWatch
Advanced Packaging (2.5D/3D, Chiplets)81Taiwan$0.40 bnPosition-early
Dry Etch & Deposition Equipment79.5USA$0.55 bnPosition-early
Analog & Mixed-Signal ICs79.25USA$2.1 bnBuild-now
SiC & GaN Epitaxial Wafers79.15Germany$0.30 bnPosition-early
RF Front-End Modules (5G)78.7USA$0.65 bnPosition-early
SiC & GaN Compound Semiconductors78Germany$0.50 bnPosition-early
Bump Materials (Solder, Copper Pillar)77.22Japan$0.14 bnBuild-now
Electronic-Grade Polysilicon76.25Germany$0.20 bnPosition-early
Photomask Blanks (EUV)75.49Japan$0.07 bnBuild-now
Leadframes & IC Substrates75.25Taiwan$0.90 bnBuild-now
IC Substrate for Flip Chip74.85Taiwan$0.14 bnBuild-now
Solder Paste & Flux (Semiconductor)74.78Japan$0.08 bnBuild-now
32-bit Microcontrollers (MCU)74.15USA$1.1 bnBuild-now
Back-End Test Equipment74.14USA$0.20 bnBuild-now
Photoresist Strippers73.56USA$0.01 bnBuild-now
ASIC Design IP (ARM Cores, PHY IP)73.2UK$0.55 bnPosition-early
Sputtering Targets (Ta, Cu, Al)71.23USA$0.07 bnBuild-now
Photomask Blanks & Reticles70.5Japan$0.18 bnPosition-early
Silicon-Germanium Wafers69.55Germany$0.04 bnBuild-now
Assembly, Test, Marking & Packaging Equipment69.25Singapore$0.45 bnBuild-now
Bump Materials (Solder, Copper Pillar)69.04Japan$0.11 bnBuild-now
150mm/200mm Silicon Wafers68.75Japan$0.35 bnBuild-now
Die Attach Films68.01Japan$0.09 bnBuild-now
Photomask Blanks (EUV)67.7Japan$0.03 bnBuild-now
Probe Cards (MEMS Type)67.26Japan$0.13 bnBuild-now
Discrete Power MOSFETs & IGBTs67.25Germany$0.80 bnBuild-now
CMP Slurries (Chemical Mechanical Planarisation)65.5USA$0.15 bnPosition-early
Specialty Gases for Semiconductor Fab63.75Japan$0.30 bnBuild-now
Bonding Wire (Gold, Silver, Copper)60Japan$0.40 bnBuild-now
Opportunity radar

Localisation opportunities

60Watch
Leadframes & IC Substrates
₹5,000 cr · gov support High
60Watch
Discrete Power MOSFETs & IGBTs
₹2,000 cr · gov support High
60Watch
Bonding Wire (Gold, Silver, Copper)
₹800 cr · gov support Medium

Key Indian manufacturers

Meerut Electronics Pvt Ltd (MEPL)SignalchipContinental Device IndiaSaankhya LabsSahas ElectronicsHindustan PlatinumAgnit SemiconductorsCentre for Development of Advanced Computing (C-DAC)Raj SolarINOX Air ProductsSemiconductor Laboratory (SCL)SITAC MicrosystemsLinde India

PLI performance

  • Semiconductor & Display Manufacturing0%

Confidence: Reasoned estimate. Part of Techadyant Labs' Critical Manufacturing Dependencies (Edition I).